M. Benke, Zs. Salyi, V. Takats, A. Csik, P. Rugoczky, G. Kaptay

Materials Science and Technology 35/6 (2019) 680-686 Impact factor²⁰¹⁹: 1.835

DOI: 10.1080/02670836.2019.1582192

Published: 9 February 2019

Independent citation: 1

Abstract

The behaviour of TiB₂ coated steel in Sn-Ag–Cu based solder melt was investigated. The samples were subjected to immersion tests in static solder melt for 40 days at 593 K. The reactions at the solder/native oxide layer covered TiB₂/substrate and solder/oxide layer-free TiB₂/substrate interfaces were investigated with X-ray diffraction, secondary neutral mass spectrometry, X-ray photoelectron spectroscopy, scanning electron microscopy and energy dispersive spectroscopy. The thermodynamic background of possible reactions is also presented. It was found that neither oxide covered, nor oxide layer-free TiB₂ showed any observable reaction with the Sn-Ag–Cu solder melt.